Viscoelastic Properties of an Epoxy Resin during Cure
نویسندگان
چکیده
The cure dependent relaxation modulus of an epoxy resin was investigated over the entire range of cure extent. Parallel plate rheometry was used to measure the material behavior below the gel point of the epoxy network. Creep testing in three-point bend was used for specimens cured past gelation. All data were converted to the stress relaxation modulus for comparison of the material behavior among the various cure states and between the two experimental techniques. The data were used to develop a practical model for predicting the cure dependence of the relaxation modulus throughout cure under varying processing conditions.
منابع مشابه
Investigating the Effect of Modifier Chain Length on Insulation Properties of Polysulfide Modified Epoxy Resin
Polysulfide resins,with trade name of G4 and G112, with short and long chain lengths respectively, were used as reactive modifiers to toughen epoxy resin. The effects of molecular weights of G4 and G112 on impact resistance, dielectric constant, thermal conductivity as well as decomposition heat and adhesion properties of toughened epoxy were investigated. The impact strength and the diel...
متن کاملOptimization of thermal curing cycle for a large epoxy model
Heat generation in an exothermic reaction during the curing process and low thermal conductivity of the epoxy resin produces high peak temperature and temperature gradients which result in internal and residual stresses, especially in large epoxy samples. In this paper, an optimization algorithm was developed and applied to predict the thermal cure cycle to minimize the temperature peak and the...
متن کاملCharacterization of the viscoelastic properties of an epoxy molding compound during cure
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...
متن کاملThe Effect of Epoxy-Polysulfide Copolymer Curing Methods on Mechanical-Dynamical and Morphological Properties
Epoxy – Polysulfide copolymers without or with low amounts of epoxy in their structure have poor mechanical properties in oxidative curing system.To strengthen the mechanical properties of polysulfide elastomer inclusion of epoxy resin (Epon828) as hard segment was studied. FT-IR spectroscopy and rheometry were used to verify the formation of epoxy-polysulfide copolymer. Results obtained f...
متن کاملHigh-performance starch-modified graphene oxide/epoxy nanocomposite coatings: A glimpse at cure kinetics and fracture behavior
Epoxy is a versatile resin used in different fields such as coatings, colors, colorants, and composites. Adding nano-scale fillers/additives to the epoxy has valued epoxy coatings for engineering applications, and opened the time of advanced epoxy-based nanocomposite coatings. In the present work, graphene oxide GO was chemically functionalized with starch, as a natural polymer, and added to th...
متن کامل